Experimental Analysis of the Co-Deposition of Metal Cu and Nano-Sized SiC Particles with CTAB in Micro Via Filling

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In: Journal of The Electrochemical Society, 166(2019), 8, S. D237-D243
Format: E-Article
Sprache: Englisch
veröffentlicht: The Electrochemical Society
Schlagworte:
ISSN: 0013-4651
1945-7111
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finc.format ElectronicArticle
finc.mega_collection The Electrochemical Society (CrossRef)
finc.id ai-49-aHR0cDovL2R4LmRvaS5vcmcvMTAuMTE0OS8yLjA3NzE5MDZqZXM
finc.source_id 49
ris.type EJOUR
rft.atitle Experimental Analysis of the Co-Deposition of Metal Cu and Nano-Sized SiC Particles with CTAB in Micro Via Filling
rft.epage 0
rft.genre article
rft.issn 0013-4651
1945-7111
rft.issue 8
rft.jtitle Journal of The Electrochemical Society
rft.tpages 0
rft.pages D237-D243
rft.pub The Electrochemical Society
rft.date 2019-01-01
x.date 2019-01-01T00:00:00Z
rft.spage 0
rft.volume 166
authors Wu Houya
Li Zhiyi
Wang Yan
Li Xiang
Wang Fuliang
Zhu Wenhui
doi 10.1149/2.0771906jes
languages eng
url http://dx.doi.org/10.1149/2.0771906jes
version 0.9
x.subjects Renewable Energy, Sustainability and the Environment
Electrochemistry
Materials Chemistry
Electronic, Optical and Magnetic Materials
Surfaces, Coatings and Films
Condensed Matter Physics
x.type journal-article