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Thermoplastic Epoxide Resin in the Presence of Polyethylene Glycol as Hot-melt Adhesive in Clean Technology

Bibliographic Details
Journal Title: Defence Science Journal
Authors and Corporations: Mukherjee, G.S., Shukla, N., Singh, R.K., Mathur, G.N.
In: Defence Science Journal, 54, 2004, 2, p. 249-255
Media Type: E-Article
Language: Undetermined
published:
Defence Scientific Information and Documentation Centre
Subjects: